JSBTDieBondH/Output/inc/Control/CDispath.h

#pragma once
#include "SystemResources.h"
#include "CRightPick.h"
#include "CLeftPick.h"
#include "CDieBond.h"
#include "CStep.h"
#include "CEvent.h"

class  __declspec(dllexport) CDispath : public CFsmBase
{
private:
    CLASS_INFO;

    CRightPick* m_pRightPick;
    CLeftPick* m_pLeftPick;
    CDieBond* m_pDieBond;

    bool m_bIsEndBondPoint = false;             //是否为最后一颗固晶点
    THREAD_BOND_INFO_STRUCT stBondThread;       //固晶线程信息
    THREAD_BOND_INFO_STRUCT stLeftThread;       //华夫盒侧线程信息
    THREAD_BOND_INFO_STRUCT stRightThread;      //晶圆台侧线程信息
    unsigned int m_nCurrBondDieNum = 1; //当前固晶数量

    bool IsBondDone(ATTRIBUTE att);
private:
    void SetCurrBondDieNum(unsigned int iNum); //设置当前固晶数量
    void AddCurrBondDieNum(); //前固晶数量加1

    //自动固晶完成后的处理函数
    void AutoBondDoneHandle();
    //固完一个晶片时的处理函数
    void BondDoneDispathHandle();

    //空闲状态
    string Idle();
    //校准状态
    string Calib();
    //编程状态
    string Programming() { return ""; };
    //诊断状态
    string Diagnosis() { return ""; }
    //自动固晶状态
    string AutoBond();
    //手动操作状态
    string ManualOperation();

    void RunStep(DISPATH_STEP_TYPE eStep);
public:
    CDispath();
    void SetBondDieTotal(unsigned int iNum); //设置剩余固晶数量
    void SetCurrentPointToEnd();//设置当前固晶点为最后一颗固晶点

    void set_other_fsm(CLeftPick* pLeftPick, CRightPick* pRightPick, CDieBond* pDieBond);
};