JSBTDieBondH/Output/inc/Module/CBondHead.h

#pragma once
#include "CModule.h"
#include "CNozzleTable.h"
#include "CBondTable.h"
#include "CBondMatrix.h"
#include "CForceControl.h"
#include "CRCalib.h"
#include "CLookUpCalib.h"
#include "CTransferTable.h"
#include "CXYCalib.h"
#include "TipMatrix.h"
#include "CUGWatch.h"

class __declspec(dllexport) CBondHead :
    public CModule
{
public:
	CBondHead(MODULE_LIST eModuleType);
    ~CBondHead();

	virtual LONG AllocateAxis(vector<CAxis*> vecAxis);
	virtual LONG AllocateIo(vector<CIO*> vecIo);


	//void SetXAxis(CAxis* axis) { m_pXAxis = axis; }
	CAxis* GetXAxis() { return m_pXAxis; }
	//void SetYAxis(CAxis* axis) { m_pYAxis = axis; }
	CAxis* GetYAxis() { return m_pYAxis; }
	//void SetZAxis(CAxis* axis) { m_pZAxis = axis; }
	CAxis* GetZAxis() { return m_pZAxis; }
	//void SetForceZAxis(CAxis* axis) { m_pForcerZ = axis; }
	//CAxis* GetForceZAxis() { return m_pForcerZ; }
	//void SetRAxis(CAxis* axis) { m_pRAxis = axis; }
	CAxis* GetRAxis() { return m_pRAxis; }
	void SetCoord(CCoord* pCrd) { m_pCoord_XY = pCrd; }
	CCoord* GetCoord() { return m_pCoord_XY; }
	//void SetVacDO(CIO* out) { m_pBDVacGpo = out; }
	//void SetFlowDo(CIO* out) { m_pBDFlowGpo = out; }
	//void SetVacDi(CIO* input) { m_pBDVacGpi = input; }
	//void SetFlowDi(CIO* input) { m_pBDFlowGpi = input; }
	void SetNozzleTable(CNozzleTable* nozzleTable) { m_pNozzleTable = nozzleTable; }
	void SetLookUpCamera(CCameraBase* camera) { m_pLookUpCamera = camera; }
	void SetWaferTransferTable(CTransferTable* tt) { m_pWaferTransferTable = tt; }
	void SetWaffleTransferTable(CTransferTable* tt) { m_pWaffleTransferTable = tt; }
	void SetBondTable(CBondTable* pBondTable) { m_pBondTable = pBondTable; }
	
	virtual void SetHighCamera(CCameraBase* camera) {}
	virtual void SetLowCamera(CCameraBase* camera) { m_pLowCamera = camera; }
	virtual CXYCalib* GetLowCameraCalib() { return m_pLowXYCalib; }
	virtual CXYCalib* GetHighCameraCalib() { return nullptr; }
	virtual CCTDCalib* GetLowCTDCalib() { return m_pLowCTDCalib; }
	//void SetForceControl(CForceControl* force) { m_pForceControl = force; }
	CForceControl* GetForceControl() { return m_pForceControl; }
	CXYCalib* GetLookUpCameraCalib() { return m_pLookUpXYCalib; }
	CRCalib* GetHeadRCalib() { return m_pRCalib; }
	bool GetIsLocationAll() { return m_bIsLocationAll; }
	CPRStrategy* GetPRStrategy() { return m_pPR; }

	virtual double GetBondTempelature() { return 0; };
	virtual LONG RunUltra(ST_PROTOCOL_WRITE_PARA  sProtocolWritePara) { return OK; };
	

	virtual LONG ToHome();
    virtual LONG ToSafePosition();
	virtual LONG GetParam();
	LONG XYMove(double x, double y, bool bSync = true);
	LONG XYMoveTo(double x,double y, bool bSync = true);
	LONG XYZMoveTo(double x, double y,double z);
	LONG XYZRMoveTo(double x, double y, double z,double r);

	virtual LONG MoveToPickGrabPos(bool waitDone = true);

#pragma region  自动取晶流程
	LONG CalcPickHigh(int index, double &dPreHigh,double &dPickHigh);
	LONG CalcBondHigh(int index, double& dPreHigh, double& dBondHigh);

	LONG MoveTransferTableToCalibPos(int index);
	LONG MoveTransferTableToGetDiePos(int index);
	LONG SetTransferTableVacuum(int index,bool bOn);

	virtual LONG ToTransporterTablePickGrab(int index, X_Y_ANGLE_STRUCT& result);//中转台拍照，返回拍照结果，拍照结果仅用于拾取偏移，不存储
	virtual LONG PickDieDown(int index, X_Y_ANGLE_STRUCT result);//传入拍照结果进行拾取补偿偏移
	LONG PickDieUp(int index,bool waitDone = true);//上行到安全位置

	LONG PcbAln(int index);  //Pcb对点
	LONG BondPointGrab(int index, X_Y_ANGLE_STRUCT& stBondOffset);//固晶点拍照
	LONG IdentifyBondPointPos(int index);
	LONG HeadMoveToBondPos(int index, bool bGrab = true, X_Y_ANGLE_STRUCT lookUpOffsetPixel = { 0,0,0 });//移动到拾取位，带补偿
	
	LONG RunTemperatureList(UINT iBondIndex);
	LONG RunTemperatureList(UINT iBondIndex, std::vector <TEMPERATURE_LIST_STRUCT> vecTemperatureList);
	LONG BondDieUp(int index, bool waitDone = true);

	virtual LONG PickDie(int index);//拍照，取晶，并上行到上视拍照位，主要用于自动流程
	virtual LONG BondDie(int index, X_Y_ANGLE_STRUCT lookUpOffsetPixel = { 0,0,0 }) = 0;

	LONG LookUpGrab(int index, X_Y_ANGLE_STRUCT& result);//移动到上视拍照位，拍照结果放到结构体中
	LONG LookUpGrabAndAdjust(int index, X_Y_ANGLE_STRUCT& result);
	LONG MoveToLookUpAndGrab(int index, X_Y_ANGLE_STRUCT& result);

#pragma endregion

	virtual LONG MoveToBondGrabPos(int index, XY_DOUBLE_STRUCT grabPosOffset = { 0,0 });
	virtual LONG XYZToLookUpGrabPos();  //注意Z轴 去安全位置
	
	
	virtual LONG BondGrab(int index, X_Y_ANGLE_STRUCT& result); //返回的拍照结果为物理单位
	virtual LONG PcbAln();  //Pcb对点

	virtual LONG ToBondPos_AddOffset(int index, X_Y_ANGLE_STRUCT bondOffset, X_Y_ANGLE_STRUCT lookUpOffset, bool waitDone = true);//传入物理位置
	virtual LONG BondDieDown(int index) = 0;//传入物理位置
	

#pragma endregion


#pragma region  手动流程
	int GetCurBondDieIndex() { return m_nCurBondDieIndex; }

	virtual LONG CameraMoveToBondPos(int index, bool bGrab = true);
	virtual LONG ToBondGrabPos_AddOffset(int index, bool waitDone = true);
	virtual LONG ToPickGrabPos_AddOffset(int index, bool waitDone = true);





	LONG CalcHeadAngleOffset(XY_DOUBLE_STRUCT stCameraPos,double stSearchAngle, X_Y_ANGLE_STRUCT& result);

	LONG MoveToPreBondGrabPoint();
	LONG MoveToNextBondGrabPoint();

	virtual LONG VacuumOn(long lDelay);		//真空开,真空延时，ms
	virtual LONG VacuumOff(long lDelay);		//真空关,吹汽延时，ms
	virtual LONG StrongOn();		//强吹开
	virtual LONG StrongOff();		//强吹关

	virtual LONG UltraOn() { return OK; };			//超声开
	virtual LONG UltraOff() { return OK; };	//超声关

	virtual LONG ChangeNozzle(int nozzleIndex);
	virtual LONG UnLoadNozzle();
	virtual LONG LoadNozzle(int nozzleIndex);
	virtual LONG CheckDieExistStatus(bool& bExist);

	virtual LONG MoveLowCameraToNozzle();
	virtual LONG MoveNozzleToLowCamera();

	//吸嘴取晶

	virtual LONG PickUpToGrabPos();

	//吸嘴固晶
	//virtual LONG CameraMoveToBondPos(int index, bool bGrab = true, X_Y_ANGLE_STRUCT lookUpOffsetPixel = { 0,0,0 });//移动到拾取位，带补偿，可用于观察补偿值是否正确
	//virtual LONG ToBondGrabPos_AddOffset(int index, X_Y_ANGLE_STRUCT bondOffset, X_Y_ANGLE_STRUCT lookUpOffset, bool waitDone = true);//传入物理位置

	virtual LONG BondCheck(int index) { return OK; };
	virtual LONG FindForce(double force);		//寻压，寻找力控轴反馈位置
	virtual LONG UpdateForce(double dForce);		//切换力的大小
	virtual LONG GetCurForceCurrentPercent(short& current);
	virtual LONG GetCurForce(double& force);
	virtual LONG Sync();

	//virtual LONG PickHightTest();
	//virtual LONG BondHighTest();


	virtual LONG WaitTemprature(double dMinTempelature, double dMaxTempelature, long lTimeOut) { return OK; };
	virtual LONG SetTemprature(double dTemprature, long lTimeOut = 0) { return OK; };

	//标定
	//virtual LONG HighCameraCTDCalib() { return OK; }
	virtual LONG LowCameraPosCalib();
	virtual LONG LowCTDNozzlePosCalib();
	virtual LONG CalLowCTDResult();

	virtual LONG HighCTD_ToCameraCalibPos() { return OK; };
	virtual LONG HighCTD_ToHeadCalibPos() { return OK; };
	virtual LONG HighCTD_CameraPosCalib() { return OK; };
	virtual LONG HighCTD_NozzlePosCalib() { return OK; };
	virtual LONG HighCTD_CalResult() { return OK; };



	virtual LONG NozzleRotCenterCalib();

	virtual LONG RAxisZeroOffsetCalib();

	virtual LONG LowCameraXYCalib();
	virtual LONG HighCameraXYCalib() { return OK; };
	virtual LONG LookUpCameraXYCalib();

	//创建模板
	virtual LONG CreateLowCameraTemp(UINT &iTemplateId);
	virtual LONG CreateHighCameraTemp(UINT& iTemplateId) { return OK; };
	virtual LONG CreateLookUpCameraTemp(UINT& iTemplateId);

	//创建流程模板
	virtual LONG CreateBondMatrixTemplate(BOND_MATRIX_TEMPLATE_TYPE eType, UINT iBondInfoId);
	virtual LONG CreatePrStrategy(vector<MULTI_TEMP_STRUCT> vecTemplateId);
	//力控标定
	virtual LONG SpringForceCalib();
	virtual LONG CurrentForceCalib();

	//创建标定模板
	virtual LONG CreateLowCameraCalibTemp();
	virtual LONG CreateHighCameraCalibTemp();
	virtual LONG CreateLookUpCameraCalibTemp();
	virtual LONG CreateRCalibTemp();

	virtual LONG CreateCTDLookUpCameraTemp();
	virtual LONG CreateCTDLowCameraTemp();
	virtual LONG CreateCTDTipTemp();

	virtual LONG CreateHighCTDLookUpTemp() { return OK; };
	virtual LONG CreateHighCTDHeadCameraTemp() { return OK; };
	virtual LONG CreateHighCTDNozzleTemp() { return OK; };



	//相机吸嘴位置切换
	virtual LONG LowCameraToHead();
	virtual LONG HeadToLowCamera();
	virtual LONG HighCameraToHead();
	virtual LONG HeadToHighCamera();

	//力控测试
	virtual LONG ForceTest();

	//高度测试
	virtual void SetPickHTestIndex(int index);
	virtual void SetBondHTestIndex(int index);
	virtual LONG PickHightTest();//调用之前先SetIndex
	virtual LONG AllBondHighTest() = 0;
	virtual LONG BondHighTest();

	virtual LONG NozzleHighTest(int nozzleIndex);//index 比较难传？

	//创建流程模板
	//virtual LONG CreatePickTemp();
	
	//virtual LONG CreateLookUpTemp();

	//virtual LONG CreateBondTemp();

	//界面测试
	void ViewTest() 
	{
		PopWarn(AlarmID::AxisHomeError,"view message box test");
		//m_dSafePosZ++;
		//m_pModuleConfigDB->SetConfigParam(ULTRAHEAD_TABLE_NAME ,*GetConfigVector());
	}

protected:
	BOND_PARAM m_stBondParam;
	CBondMatrix* m_pBondMatrix = nullptr;
	CForceControl* m_pForceControl = nullptr;
	CTransferTable* m_pWaferTransferTable = nullptr;
	CTransferTable* m_pWaffleTransferTable = nullptr;
	CNozzleTable* m_pNozzleTable = nullptr;
	CBondTable* m_pBondTable = nullptr;

	CCameraBase* m_pLowCamera = nullptr;
	double m_dLowCameraLookupAngleOffset; //与上视相机角度差

	CAxis* m_pXAxis = nullptr;
	CAxis* m_pYAxis = nullptr;
	CAxis* m_pZAxis = nullptr;
	CAxis* m_pRAxis = nullptr;
	//CAxis* m_pForcerZ = nullptr;
	CIO* m_pForcerDo = nullptr;
	CIO* m_pForcerAO = nullptr;
	CIO* m_pBDVacGpo = nullptr;
	CIO* m_pBDFlowGpo = nullptr;
	CIO* m_pBDVacGpi = nullptr;
	CIO* m_pBDFlowGpi = nullptr;
	CIO* m_pForceScale = nullptr;
	CCoord* m_pCoord_XY = nullptr;



	CCameraBase* m_pLookUpCamera = nullptr;
	CXYCalib* m_pLookUpXYCalib = nullptr;//上视相机XY标定
	CXYCalib* m_pLowXYCalib = nullptr;
	CRCalib* m_pRCalib = nullptr;
	CCTDCalib* m_pLowCTDCalib = nullptr;
	CPRStrategy* m_pPR = nullptr;
	TipMatrix* m_pTipMatrix = nullptr;

	//位置参数
	double m_dSafePosX = 0;//安全位置
	double m_dSafePosY = 0;
	double m_dSafePosZ = 0;
	double m_dInitPosR = 0;

	double m_dPickGrabPosX = 0;  //取晶位置
	double m_dPickGrabPosY = 0;
	double m_dPickGrabPosZ = 0; //拾取拍照位

	double m_dLookUpGrabPosX = 0;
	double m_dLookUpGrabPosY = 0;
	double m_dLookUpGrabPosZ = 0;

	//double m_dBond
	double m_dBondGrabPosZ = 0;			//bondGrabPosZ

	double m_dPreChangeNozzleDisY = 0;//预更换吸嘴偏差位置
	double m_dNozzlePosZ = 0;		  //吸嘴架位置Z

	//统计参数
	int m_nTipUsedNum = 0;
	int m_nTipUsedMaxNum = 0;

	int m_nCurNozzleIndex = 0; //当前吸嘴在吸嘴架上的编号
	//int nCurrBondHeadIdByTable;		//当前使用的吸嘴在吸嘴台上编号
	//XY_DOUBLE_STRUCT stCalibTableBondPosition;		//校准台固晶位置

	//double m_dPressDistance = 0; //压合距离,修改为反馈位置
	double m_dPickVel = 0; //慢速
	double m_dSearchForce = 0;
	double m_dHoldForce = 0;  //保持力
	double m_dPickSearchPosZ = 0;//拾取高度测试搜索位置
	double m_dBondSearchPosZ = 0;//固晶高度测试搜索位置
	//double m_dNozzlePosY = 0;//吸嘴架位置Y
	double m_dNozzleTableOriginPosX = 0;
	double m_dNozzleTableOriginPosY = 0;

	int m_nPickHTestDieIndex = 1;
	int m_nBondHTestDieIndex = 1;

	bool m_bIsLocationAll = false; //用于固晶时补偿可选全部拍照补偿或者每个PCB只拍一次

	double m_dGivenForceZPos = 0;		//拾取放置芯片时力控轴的反馈位置



	bool m_bAngleOffsetEnabled = false;

	double m_dNozzleHTestX = 0;
	double m_dNozzleHTestY = 0;
	double m_dNozzleHTestSearchPosZ = 0;

	//测高
	int m_nPickHNozzleIndex = 0;
	int m_nBondHNozzleIndex = 0;
	double m_dPickContactPosZ = 0;   //拾取测高高度
	double m_dBondContactPosZ = 0;		//固晶测高高度

	int m_nCurBondDieIndex = 0;


};