JSBTDieBondH/Output/inc/Module/CBondTable.h

#pragma once
#include "CModule.h"
#include "CTemperature.h"

/*共晶台和固晶台，机械上的差距是共晶台没有真空，均定义真空IO对象，共晶台流程不调用真空开关*/
class  __declspec(dllexport) CBondTable :
    public CModule
{
	//设备类型
	enum TemperatureStatus { 
		Disable = 0 /*禁用*/, 
		BondOpen = 1, /*工作时开，处于预备温度，工作时升到固晶温度*/ 
		BnormallyOpen = 2 /*常开，一直在固晶温度*/ 
	};

	typedef struct _BOND_TABLE_CONFIG_STRUCT
	{
		double dWaitPosZ;					//安全位置
		double dBondPosZ;					//工作位置
		long dVacuumDelay;						//真空延时

		TemperatureStatus eOpenStatus;	//温控器工作状态
		double nBondTempelature;			//固晶温度
		double nPreTempelature;			//预备温度
		std::string sTemperatureCtrlPort; //温控器端口
		int nAddress;						//站点地址
		Temperature_Ctltype nTemCtrlType;	//温控器类型

		double dCurTempelature;
		double dSetTempelature;
		_BOND_TABLE_CONFIG_STRUCT()
		{
			dWaitPosZ = 0;					
			dBondPosZ = 0;	

			eOpenStatus = TemperatureStatus::Disable;
			nBondTempelature = 0; 
			nPreTempelature = 0;  
			sTemperatureCtrlPort = "192.168.1.10";
			nAddress = 0x5;
			nTemCtrlType = GLTC;

			dCurTempelature = 0;
			dSetTempelature = 0;
		}
	} BOND_TABLE_CONFIG_STRUCT;   

public:
	CBondTable(MODULE_LIST eModuleType);
	~CBondTable();

	virtual void SetDataChangFunction() override;
	virtual void DataChangNotice(string strDbName, string strTableName) override;
	virtual LONG SetParam() override;//保存配置参数
	virtual LONG GetParam() override;//加载配置参数
	virtual LONG ToHome() override;
	virtual LONG Sync() override;
	virtual LONG ToSafePosition() override;
	virtual LONG InitResource();

	virtual LONG AllocateAxis(vector<CAxis*> vecAxis) override;
	virtual LONG AllocateIo(vector<CIO*> vecIo) override;

	////检测物料到位
	//bool CheckPcbArrive();

	////检测物料移开
	//bool CheckPcbLeave();
	
	//平台上升到固晶位置
	LONG ToBondPos(bool waitDone);

	//平台下降，允许上下料
	LONG ToWaitPos(bool waitDone);

	LONG SetVacuumOn();
	LONG SetVacuumOff();
	LONG WaitVacuumDone();

	bool CheckZDone();

	//设置工作台温度为固晶温度 lTimeOut (毫秒)>0时，等待温度到达5%范围内
	LONG SetBondTemprature(long lTimeOut = 5000);
	//设置工作台温度为预备温度
	LONG SetPreTemprature(long lTimeOut = 5000);
private:
	CAxis* m_pAxisZ = nullptr;
	//CIO* m_pPcbArriveDi = nullptr;
	//CIO* m_pPcbLeaveDi = nullptr;
	CIO* m_pVacDo = nullptr;

	BOND_TABLE_CONFIG_STRUCT m_stConfig;

	//温控器
	bool m_TemperatureIsUse = false;   //温控器是否启用
	CTemperature* m_pTempCtrl = nullptr;
public:
	LONG ReadTemperature();
	LONG UpdateTemperature();

	LONG WaitTemprature(double dMinTempelature, double dMaxTempelature, long lTimeOut);
	//设置温度
	LONG SetTemprature(double dTempelature, long lTimeOut = 0);
	double GetBondTemprature() { return m_stConfig.nBondTempelature; };

};