CBondMatrix.h 8.0 KB

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  1. #pragma once
  2. #include "CManageDB.h"
  3. #include <map>
  4. #include <mutex>
  5. #ifdef BOND_MATRIX_EXPORTS
  6. #define BOND_CMATRIX_DLL_API __declspec(dllexport)
  7. #else
  8. #define BOND_CMATRIX_DLL_API //__declspec(dllimport)
  9. #endif
  10. using namespace ns_db;
  11. namespace ns_mat
  12. {
  13. typedef struct
  14. {
  15. PICKBOND_PARAM_STRUCT stWaferParam; //晶片台\华夫盒取晶参数
  16. PICKBOND_PARAM_STRUCT stCalibBondParam; //校准台放晶参数
  17. UINT nTemplate_Pick; //取晶模板号
  18. UINT nPickHeadIdByTable; //取晶吸嘴在吸嘴架上的Id号
  19. UINT nMatrixId; //使用的晶片台\华夫盒号(矩阵号)
  20. }PICK_PARAM;
  21. struct BOND_PARAM
  22. {
  23. //固晶过程中用到得数据,且由用户设置,需保存到数据库的参数
  24. PICKBOND_PARAM_STRUCT stCalibPickParam; //校准台取晶参数
  25. PICKBOND_PARAM_STRUCT stBondParam; //固晶台固晶参数
  26. bool bIsAllBondAln = false; //固晶点是否逐个对点
  27. bool bIsPcbAln = false; //是否Pcb对点
  28. UINT nTemplate_BondFront = 0; //固前检测模板ID号 0为不检测
  29. UINT nTemplate_BondBack = 0; //固后检测模板ID号 0为不检测
  30. //UINT nTemplate_SearchModel; //到模板位置后是否拍照 0为不拍照
  31. UINT nTemplate_PcbAln = 0; //PCB 对点
  32. UINT nTemplate_BondAln = 0; //固晶点对点模板ID号
  33. UINT nTemplate_Calib = 0; //中转台校准模板号 0为不拍照
  34. UINT nTemplate_LookUp = 0; //上视对点模板号 0为不拍照
  35. UINT nBondHeadIdByTable = 0; //固晶吸嘴在吸嘴架上的Id号
  36. X_Y_ANGLE_STRUCT stOffset; //固晶点补偿(从编程的固晶点位置偏移)
  37. };
  38. //固晶参数,由用于设置得到
  39. typedef struct
  40. {
  41. //全局把握的参数
  42. UINT iPcbMatId; //对应的pcb号
  43. CALIB_DIE_TYPE nCalibType; //校准方式 0:不校准 1:下视校准 2:校准台校准
  44. DIE_SOURCE nWaffleOrWaffer; //0:华夫盒,1:晶圆台
  45. double dDieHeight; //芯片厚度
  46. PICK_PARAM nPickParam;
  47. BOND_PARAM nBondParam;
  48. }PROCESS_INFO_STRUCT;
  49. //固晶顺序
  50. enum BOND_DIR {
  51. NO_SET = 0,
  52. //order顺序,按照遍历大矩阵第一格所有小矩阵再遍历第二格
  53. //Alternate顺序,按照遍历完相同的小矩阵再遍历第二种小矩阵
  54. OrderAndS = 1,/*弓字型*/
  55. AlternateAndZ = 2,
  56. OrderAndZ = 3,/*之字型*/
  57. AlternateAndS = 4,
  58. };
  59. typedef struct _BOND_INDEX_STRUCT
  60. {
  61. int iInfoId = 1;
  62. //UINT iProductId = 1; //固晶点所在产品Id
  63. UINT iPcbMatId = 1; //固晶点所在PCB Id
  64. UINT iPcbRow = 1; //固晶点在PCB中所在行
  65. UINT iPcbCol = 1; //固晶点在PCB中所在列
  66. UINT iPtMatId = 1; //固晶点所在Pt矩阵Id
  67. UINT iPtRow = 1; //固晶点在矩阵中所在行
  68. UINT iPtCol = 1; //固晶点在矩阵中所在列
  69. UINT iIndex = 1; //当前Point在整个Bond矩阵中的序号
  70. } BOND_MATRIX_POINT_INFO_STRUCT; //固晶点
  71. enum DIE_STATUS {
  72. //NO_PICK = 0, /*未取晶*/
  73. //WAF_PICK_DONE, /*已从晶片台取晶*/
  74. //TRANSFER_BOND_DONE, /*已将晶片放到中转台*/
  75. NO_BOND, //未进入固晶状态
  76. TRANSFER_PICK_DONE, /*已从中转台取晶*/
  77. LOOKUP_CALIB_DONE, /*已上视校准*/
  78. BOND_DONE, /*已固晶*/
  79. BOND_DEL /*不固晶点*/
  80. };
  81. enum PICK_STATUS
  82. {
  83. NO_PICK = 0, /*未取晶*/
  84. WAF_PICK_DONE, /*已从晶片台取晶*/
  85. TRANSFER_BOND_DONE, /*已将晶片放到中转台*/
  86. };
  87. //过程产生的关联数据
  88. typedef struct _BONDED_STATUS_STRUCT
  89. {
  90. //流程过程中的状态数据,不保存到数据库中
  91. DIE_STATUS bDieStatus; //固晶状态
  92. PICK_STATUS bPickStatus; //取晶状态
  93. bool bAlnStatus; //对点状态,是否已对点
  94. bool bIsCheck; //是否固后检测完成
  95. XY_DOUBLE_STRUCT stPcbLeftTop; //PCB矩阵左上角坐标(界面用)
  96. XY_DOUBLE_STRUCT stPtLeftTop; //PT矩阵左上角坐标(界面用)
  97. X_Y_ANGLE_STRUCT stLookUpOffset; //上视拍照偏差结果
  98. XY_DOUBLE_STRUCT stSetBondPosition; //程序设置的固晶位置
  99. X_Y_ANGLE_STRUCT stAlnOffset; //固晶点对点偏移
  100. X_Y_ANGLE_STRUCT stPcbAlnOffset; //PCB 对点偏移
  101. XY_DOUBLE_STRUCT stAlnBondPosition; //对点后的固晶位置
  102. //double dAlnAngle; //对点角度
  103. X_Y_ANGLE_STRUCT stCheckOffset; //固后检测结果
  104. //double dCheckAngle; //固后检测角度
  105. _BONDED_STATUS_STRUCT()
  106. {
  107. bDieStatus = NO_BOND;
  108. bPickStatus = NO_PICK;
  109. bAlnStatus = false;
  110. bIsCheck = false;
  111. stPcbLeftTop = 0;
  112. stPtLeftTop = 0;
  113. stSetBondPosition = 0;
  114. stAlnBondPosition = 0;
  115. //dAlnAngle = 0;
  116. //dCheckAngle = 0;
  117. stCheckOffset = { 0,0,0 };
  118. }
  119. } BOND_STATUS_STRUCT;
  120. typedef struct _POINT_INFO_STRUCT
  121. {
  122. BOND_MATRIX_POINT_INFO_STRUCT stIndex;
  123. BOND_STATUS_STRUCT stBondStatus;
  124. PROCESS_INFO_STRUCT stBondInfo;
  125. } POINT_INFO_STRUCT;
  126. /// <summary>
  127. /// 固晶、取晶编程位置信息
  128. /// </summary>
  129. class BOND_CMATRIX_DLL_API CBondMatrix
  130. {
  131. //enum type { pick, bond };
  132. private:
  133. static std::mutex m_MatrixMutex;
  134. bool bIsInitSuccess = false;
  135. //当前点
  136. UINT m_iCurrentBondIndex = 0;
  137. //矩阵总数
  138. UINT m_iBondAmount = 0;
  139. int m_iWaferDieNum = 0;
  140. int m_iWaffleDieNum = 0;
  141. BOND_DIR m_eBondDir = BOND_DIR::NO_SET;
  142. CProduct* m_pCProduct = nullptr;
  143. //缓存数据结构建议修改
  144. vector<PROGRAM_BOND_MATRIX_STRUCT> m_vetBondMatrix; //Pcb矩阵,从数据库读出来未经处理的数据
  145. std::vector<BOND_INFO_STRUCT> m_vetBondInfo;
  146. map<int, POINT_INFO_STRUCT> m_mapBondMatrixInfo;
  147. private:
  148. void Sort_OrderAndZ();
  149. void Sort_AlternateAndZ();
  150. void Sort_OrderAndS();
  151. void Sort_AlternateAndS();
  152. POINT_INFO_STRUCT CalPointInfo(UINT iPtId, PROGRAM_BOND_MATRIX_STRUCT pcbMatrix, PROGRAM_POINT_MATRIX_STRUCT ptMatrix,
  153. int pcbRow, int pcbCol, int pointRow, int pointCol);
  154. LONG BondInfoConvertPorcessInfo(UINT iPcbId, BOND_INFO_STRUCT stBondInfo, PROCESS_INFO_STRUCT& stProcessInfo);
  155. void ProcessPointMatrix(const PROGRAM_BOND_MATRIX_STRUCT& pcbMatrix, const PROGRAM_POINT_MATRIX_STRUCT& pointMatrix, int i, int j);
  156. //void RecvTableChangNoticeFunction(string dbname, string tabname);
  157. void DataChangNotice(string strDbName, string strTableName);
  158. void SetAllData();
  159. void SetDBBondInfo(int ptIndex, POINT_INFO_STRUCT pointIndo);
  160. public:
  161. CBondMatrix();
  162. LONG LoadMatrix(BOND_DIR dir);
  163. public:
  164. //返回0表示没找到
  165. UINT GetCurrentIndex(); //获取当前固晶点
  166. LONG SetCurrentIndex(UINT nIndex); //设置当前固晶点
  167. LONG GetAllBondMatrixInfo(std::vector <POINT_INFO_STRUCT>& stPointInfo);
  168. //获取包括当前固晶点开始的下个固晶点 若返回-1 说明已经到结尾,没有下一个了
  169. UINT GetNextBondIndex(UINT nIndex); //获取从当前固晶点开始的下个固晶点
  170. UINT GetPrevBondIndex(UINT nIndex);
  171. UINT GetNextPickIndex(UINT nIndex,DIE_SOURCE eSource = DIE_SOURCE::BY_NUL); //获取从当前固晶点开始的下个固晶点
  172. UINT GetPrevPickIndex(UINT nIndex, DIE_SOURCE eSource = DIE_SOURCE::BY_NUL); //获取从当前固晶点开始的上个固晶点
  173. UINT GetAmount(); //获取总数
  174. int GetWaferPickAmount();
  175. int GetWafflePickAmount();
  176. //获取指定晶圆的位置信息
  177. LONG GetPintInfoByIndex(UINT nPtIndex, POINT_INFO_STRUCT& stPointInfo);
  178. LONG SetPintInfoByIndex(UINT nPtIndex, POINT_INFO_STRUCT stPointInfo); //要找到同一矩阵的所有点?
  179. LONG GetAllBondParam(UINT nPtIndex,BOND_PARAM& bondParam);
  180. LONG GetAllPickParam(UINT nPtIndex, PICK_PARAM& pickParam);
  181. LONG SetBondParam(int nPtIndex, const BOND_PARAM& bondParam); //要找到同一矩阵的所有点?
  182. LONG SetPickParam(int nPtIndex, const PICK_PARAM& pickParam); //要找到同一矩阵的所有点?
  183. /// <summary>
  184. /// 设置固晶点对点信息,设置时,固晶点编号所应就的PCB一起设置并计算对点的位置
  185. /// </summary>
  186. /// <param name="nPtIndex">固晶点编号</param>
  187. /// <param name="stBasePosn">基准位置</param>
  188. /// <param name="dBaseAngle">基准角度</param>
  189. /// <param name="stAlnPosn">对点位置</param>
  190. /// <param name="dAlnAngle">对点角度</param>
  191. /// <returns></returns>
  192. LONG SetBondAlnInfo(UINT nPtIndex, XY_DOUBLE_STRUCT stBasePosn, DOUBLE dBaseAngle, XY_DOUBLE_STRUCT stAlnPosn, DOUBLE dAlnAngle);
  193. LONG SetPcbAlnOffset(X_Y_ANGLE_STRUCT offset); //设置PCB补偿参数
  194. LONG GetPcbAlnOffset(int index, X_Y_ANGLE_STRUCT& offset);
  195. LONG SetBondAlnOffset(int index, X_Y_ANGLE_STRUCT offset); //流程数据
  196. LONG SetLookupOffset(int index, X_Y_ANGLE_STRUCT offset); //流程数据
  197. LONG ResetAlnStatus(UINT nPtIndex); //清除对点状态,固晶点编号所对应的PCB一起清除
  198. LONG SetDieStatus(UINT nPtIndex, DIE_STATUS eStatus); //设置固晶状态
  199. LONG SetPickStatus(UINT nPtIndex, PICK_STATUS eStatus); //设置取晶状态
  200. LONG ClearWaferPickStatus();
  201. LONG ClearWafflePickStatus();
  202. LONG ClearAllBondInfo(); //清除所有固晶点的状态及信息
  203. };
  204. }