JSBTDieBondH/Output/inc/Module/CWaferTable.h

#pragma once
#include "CModule.h"
#include "CCameraBase.h"
#include "CRCalib.h"
#include "CXYCalib.h"
#include "HorizMeasure.h"


enum SOFTLIMITTYPE { SL_NONE = 0, SL_CIRCLE, SL_RECT }; //SL_NONE: 不使用, SL_CIRCLE: 圆形范围限位, SL_RECT: 矩形范围限位
enum SEARCH_DIRECTION { WAF_LEFT = 0, WAF_DOWN, WAF_RIGHT, WAF_UP, WAF_MAX };
enum FIND_DIE { U_L = 0, U_C, U_R, C_L, C_C, C_R, D_L, D_C, D_R, MAX };
typedef struct
{
    X_Y_R_STRUCT stCurPickPosn;			//晶片台当前取晶位置
    DOUBLE dDistanceX;					//晶片台上晶片间距X
    DOUBLE dDistanceY;                  //晶片台上晶片间距Y
    SEARCH_DIRECTION enDirMain;			//首选搜索方向
    SEARCH_DIRECTION enDirMinor;		//次选搜索方向
}WAFER_SEARCHDIE;

typedef struct _SAVE_FIND_DIE
{
    bool bUse;
    X_Y_R_STRUCT stPosition;
    _SAVE_FIND_DIE()
    {
        bUse = false;
        stPosition = { 0.0,0.0,0.0 };
    }
}SAVE_FIND_DIE;



class __declspec(dllexport) CWaferTable :  public CModule
{

#define SAVE_DIE_POSITION_CONUT 3

    typedef struct
    {
        bool UseMatrix;				                //采用设置矩阵的取晶方式
        MATRIX_SEARCH_DIR SearchMatrixDir;          //搜矩阵顺序
        UINT TemplateId;				            //搜晶拍照模板
        UINT DelayTakePicture;			            //拍图延时
        UINT LoseDieCount;                          //晶片台失晶数量，找寻下一颗晶片时，连续找不到LoseDieCount颗晶片则换行或报警
        UINT PickDieAgainNum;			            //重复取晶次数
        UINT ForecastCount;			                //提前告警数量

        UINT DieLong;                               //晶片长 um
        UINT DieWide;                               //晶片宽 um

        X_Y_Z_R_STRUCT SafePosition;                //安全位置
        X_Y_Z_R_STRUCT DownRingPosition;            //上、下晶环位置

        XY_DOUBLE_STRUCT stWorkRangeCenter;         //晶环中心
        DOUBLE dSoftLimitRadius;			        //3点画圆软限位半径(圆心就是旋转中心)
        SOFTLIMITTYPE enSoftLimitType;              //是否使用3点画圆的软限位,一般情况下只有使用蓝膜的晶片台使用
    } WAFERTABLE_CONFIG_STRUCT;     //晶片台参数配置

public:
    CWaferTable(MODULE_LIST eModuleType);
    ~CWaferTable(){}
    void SetCamera(CCameraBase* camera) { m_pCamera = camera; }

    virtual LONG AllocateAxis(vector<CAxis*> vecAxis) override;
    virtual LONG AllocateIo(vector<CIO*> vecIo) override;

    void SetCoord(CCoord* pCrd) { m_pCoord = pCrd; }

    CXYCalib* GetWaferXYCalib() { return m_pXYCalib; }
    CRCalib* GetWaferRCalib() { return m_pRCalib; }

    virtual LONG ToHome() override;
    virtual LONG Sync() override;
    virtual LONG ToSafePosition() override;
    virtual LONG InitResource() override;

    //到起始晶片位置
    LONG ToFirstDie();
    //去到上一颗晶片位置
    LONG ToPreDie();
    //去到下一颗晶片位置
    LONG ToNextDie();
    //去到指定序号的晶片位置
    LONG ToIndexDie(UINT nIndex);
    //移至当前晶片中心
    LONG ToDieCenter();
    //搜索芯片
    LONG SearchDie();

    //到上下晶环位置
    LONG ToChangeRingPosition();
    //更换晶环完成
    LONG ChangeRingDone();

    //设置3点画圆软限位的半径及圆心(圆心就是旋转中心)
    LONG SetSoftLimitRadius(SOFTLIMITTYPE nSoftLimitType, XY_LONG_STRUCT stPosn1, XY_LONG_STRUCT stPosn2, XY_LONG_STRUCT stPosn3);
    LONG GetSoftLimitRadius(double& dCenterX, double& dCenterY, double& iRadius);
    LONG GetDieSize(int& iLong, int& iWide);

    LONG CreateCameraCalibTemplate();
    LONG CreateRCalibTemplate();
    LONG CameraCalib();

    LONG CreateDieTemplate();//创建搜索晶片模板
    LONG CreateTemplate(SEARCH_OUT eResultSelect, UINT& iTemplateId);
    LONG CreatePrStrategy(vector<UINT> vecTemplateId);
private:
    CAxis* m_pXAxis = nullptr;
    CAxis* m_pYAxis = nullptr;
    CAxis* m_pZAxis = nullptr;
    CAxis* m_pRAxis = nullptr;

    CIO* m_pRingDone = nullptr;

    CCameraBase* m_pCamera = nullptr;
    CCoord* m_pCoord = nullptr;
    CXYCalib* m_pXYCalib = nullptr;
    CRCalib* m_pRCalib = nullptr;
    CHorizMeasure* m_pHorizMeasure = nullptr;
    CPRStrategy* m_pPR = nullptr;

    CProduct* m_pCProduct = nullptr;
    CWaferMatrix* m_pWaferMatrix = nullptr;

    //晶片台参数
    WAFERTABLE_CONFIG_STRUCT m_stConfig;
    WAFER_SEARCHDIE m_stSearchDie;

private:
    void DataChangNotice(string strDbName, string strTableName);

    virtual void SetDataChangFunction() override;
    virtual LONG SetParam() override;//保存配置参数
    virtual LONG GetParam() override;//加载配置参数

    //Z轴上
    LONG AxisZ_Up();
    //Z轴下
    LONG AxisZ_Down();
    //Z轴是下在下限位位置。如果不在，需禁止晶片台移动
    bool AxisZIsDown();

    LONG MoveTo(double x, double y, bool bSync = true);
    LONG MoveTo(double dX,double dY,double dR, bool bSync = true);
    LONG Move(double dX, double dY, double dR, bool bSync = true);

    bool bChangDirMain;		//是否更换主搜索方向
    //记录已找到晶片的绝对位置
    SAVE_FIND_DIE m_SaveDiePosition[SAVE_DIE_POSITION_CONUT];//保存三颗反向方的晶片位置
    void ChangeCurrentPickPosition();
    void ChangeDirMain();			//修改主搜索方向
    //选择下颗晶片位置
    FIND_DIE SelectNextDiePos(FIND_OUTPUT_STRUCT arrayDie[]);
    void CalcSearchDiePosition(X_Y_R_STRUCT stCurrentPosition, FIND_OUTPUT_STRUCT DiePosition, SAVE_FIND_DIE& OutPosition);
    void SaveSearchDiePosition(X_Y_R_STRUCT stCurrentPosition, FIND_OUTPUT_STRUCT ArrayDie[FIND_DIE::MAX]);
    //判断目标位置是否在范围内  true:在范围内   false:在范围外
    bool CheckPurPosnInRange(XY_DOUBLE_STRUCT stPurPosn);
};