JSBTDieBondH/View/die-bonder-ui/CameraMaterialGroupWnd/MaterialWindow/Bond.cpp

#include "Bond.h"
#include <QDebug>
#include <QPair>
#include <QSet>
#include <QMap>
#include <cmath>

Bond::Bond(QWidget* parent) 
    : QWidget(parent) 
{
    
}

void Bond::UpdataGenerateTestData() 
{
    //// 生成测试数据：2x2 PCB，每个PCB 2x2 PT矩阵，每个PT矩阵 2x3固晶点
    //int pcbIndex = 0;
    //int dieIndex = 0;
    //std::srand(std::time(nullptr));
    //for (int pcbRow = 0; pcbRow < 2; ++pcbRow) {
    //    for (int pcbCol = 0; pcbCol < 2; ++pcbCol) {
    //        int iPcbMatId = ++pcbIndex;
    //        pcbDimensions[iPcbMatId] = qMakePair(2, 2); // PCB包含2x2 PT矩阵

    //        int ptIndex = 0;
    //        for (int ptRow = 0; ptRow < 2; ++ptRow) {
    //            for (int ptCol = 0; ptCol < 2; ++ptCol) {
    //                int iPtMatId = ++ptIndex;
    //                ptDimensions[iPcbMatId][iPtMatId] = qMakePair(2, 3); // PT矩阵包含2x3固晶点

    //                for (int dieRow = 0; dieRow < 2; ++dieRow) {
    //                    for (int dieCol = 0; dieCol < 3; ++dieCol) {
    //                        ns_mat::POINT_INFO_STRUCT point;
    //                        point.stIndex.iPcbMatId = iPcbMatId;
    //                        point.stIndex.iPtMatId = iPtMatId;
    //                        point.stIndex.iPcbRow = pcbRow;
    //                        point.stIndex.iPcbCol = pcbCol;
    //                        point.stIndex.iPtRow = dieRow;
    //                        point.stIndex.iPtCol = dieCol;
    //                        point.stIndex.iIndex = ++dieIndex;
    //                        point.stBondStatus.bDieStatus = static_cast<ns_mat::DIE_STATUS>(std::rand() % 7);
    //                        bondData.append(point);
    //                    }
    //                }
    //            }
    //        }
    //    }
    //}
}
/*
void Bond::initFrom(QWidget* parent) {
    m_pScene = new QGraphicsScene(parent);
    m_pView = new BondGraphicsView(m_pScene);

    int width = parent->width();
    int height = parent->height();

    // Step 1: 收集PCB全局布局信息
    QMap<QPair<int, int>, int> pcbPosMap;
    QSet<int> uniquePcbIds;
    foreach(const ns_mat::POINT_INFO_STRUCT & point, bondData) {
        QPair<int, int> pos(point.stIndex.iPcbRow, point.stIndex.iPcbCol);
        if (!pcbPosMap.contains(pos)) {
            pcbPosMap[pos] = point.stIndex.iPcbMatId;
        }
        uniquePcbIds.insert(point.stIndex.iPcbMatId);
    }

    // 计算PCB全局行列数
    int maxPcbRow = 0, maxPcbCol = 0;
    for (const QPair<int, int>& pos : pcbPosMap.keys()) {
        maxPcbRow = qMax(maxPcbRow, pos.first);
        maxPcbCol = qMax(maxPcbCol, pos.second);
    }

    int pcbRows = maxPcbRow + 1;
    int pcbCols = maxPcbCol + 1;

    // Step 2: 计算PCB布局参数
    qreal margin = width / maxPcbCol * 0.05;
    qreal pcbSpacing = margin;
    int fontSize = qMax(static_cast<int>(margin), 1);
    QFont font;
    font.setPointSize(fontSize);
    qreal totalWidth = width - 2 * margin;
    qreal totalHeight = height - 2 * margin;
    qreal pcbWidth = (totalWidth - (pcbCols - 1) * pcbSpacing) / pcbCols;
    qreal pcbHeight = (totalHeight - (pcbRows - 1) * pcbSpacing) / pcbRows;

    // Step 3: 预处理数据分组
    QMap<int, QMap<int, QList<ns_mat::POINT_INFO_STRUCT>>> groupedData;
    foreach(const ns_mat::POINT_INFO_STRUCT & point, bondData) {
        groupedData[point.stIndex.iPcbMatId][point.stIndex.iPtMatId].append(point);
    }

    // 绘制PCB并记录位置
    QMap<int, QRectF> pcbRects;
    for (int row = 0; row < pcbRows; ++row) {
        for (int col = 0; col < pcbCols; ++col) {
            QPair<int, int> pos(row, col);
            if (pcbPosMap.contains(pos)) {
                int pcbId = pcbPosMap[pos];
                QRectF rect(
                    margin + col * (pcbWidth + pcbSpacing),
                    margin + row * (pcbHeight + pcbSpacing),
                    pcbWidth,
                    pcbHeight
                );
                pcbRects[pcbId] = rect;

                // 绘制PCB背景
                QGraphicsRectItem* pcbItem = new QGraphicsRectItem(rect);
                pcbItem->setBrush(QColor("#e1d4e6"));
                m_pScene->addItem(pcbItem);

                // 添加PCB标签
                QGraphicsTextItem* text = new QGraphicsTextItem(QString(tr("PCB%1")).arg(pcbId));
                text->setFont(font);

                qreal fixedHeight = qMin(pcbWidth / std::ceil(static_cast<qreal>(groupedData[pcbId].keys().size()) / std::ceil(std::sqrt(groupedData[pcbId].keys().size()))) * 0.1
                    , pcbHeight / std::ceil(std::sqrt(groupedData[pcbId].keys().size())) * 0.1);
                qreal actualHeight = text->boundingRect().height();
                if (actualHeight > 0) {
                    qreal scaleFactor = fixedHeight / actualHeight;
                    text->setScale(scaleFactor);
                }

                text->setPos(rect.x(), rect.y());
                m_pScene->addItem(text);
            }
        }
    }

    // Step 4: 绘制PT矩阵和固晶点
    foreach(int pcbId, uniquePcbIds) {
        QRectF pcbRect = pcbRects.value(pcbId);
        if (!pcbRect.isValid()) continue;

        // 获取当前PCB的所有PT矩阵
        QList<int> ptMatIds = groupedData[pcbId].keys();
        int ptMatCount = ptMatIds.size();
        if (ptMatCount == 0) continue;

        // 计算PT矩阵布局行列数（方形布局）
        int ptRows = std::ceil(std::sqrt(ptMatCount));
        int ptCols = std::ceil(static_cast<qreal>(ptMatCount) / ptRows);
        while (ptRows * ptCols < ptMatCount) ptCols++;

        qreal ptMargin = qMin(pcbWidth / ptCols * 0.1, pcbHeight / ptRows * 0.1);
        int fontSize_1 = qMax(static_cast<int>(ptMargin), 1);
        QFont font_1;
        font_1.setPointSize(fontSize_1);

        // 计算PT矩阵尺寸
        qreal ptWidth = (pcbRect.width() - (ptCols + 1) * ptMargin) / ptCols;
        qreal ptHeight = (pcbRect.height() - (ptRows + 1) * ptMargin) / ptRows;

        // 绘制每个PT矩阵
        for (int i = 0; i < ptMatIds.size(); ++i) {
            int ptId = ptMatIds[i];
            int row = i / ptCols;
            int col = i % ptCols;

            QRectF ptRect(
                pcbRect.x() + col * (ptWidth + ptMargin) + ptMargin,
                pcbRect.y() + row * (ptHeight + ptMargin) + ptMargin,
                ptWidth,
                ptHeight
            );

            // 绘制PT矩阵背景
            QGraphicsRectItem* ptItem = new QGraphicsRectItem(ptRect);
            ptItem->setBrush(QColor("#d5e4f8"));
            m_pScene->addItem(ptItem);

            // 添加PT矩阵标签
            QGraphicsTextItem* ptText = new QGraphicsTextItem(QString(tr("PT矩阵%1")).arg(ptId));
            ptText->setFont(font_1);

            qreal fixedHeight_1 = qMin(ptWidth / ptDimensions[pcbId][ptId].second * 0.3, ptHeight / ptDimensions[pcbId][ptId].first * 0.3);
            qreal actualHeight_1 = ptText->boundingRect().height();
            if (actualHeight_1 > 0) {
                qreal scaleFactor_1 = fixedHeight_1 / actualHeight_1;
                ptText->setScale(scaleFactor_1);
            }

            ptText->setPos(ptRect.x(), ptRect.y());
            m_pScene->addItem(ptText);

            // Step 5: 绘制固晶点
            QList<ns_mat::POINT_INFO_STRUCT> points = groupedData[pcbId][ptId];
            if (points.isEmpty()) continue;

            // 获取固晶点矩阵尺寸
            QPair<int, int> dieDims = ptDimensions[pcbId][ptId];
            int dieRows = dieDims.first;
            int dieCols = dieDims.second;

            qreal dieMargin = qMin(ptWidth / dieCols * 0.3, ptHeight / dieRows * 0.3);

            // 计算固晶点尺寸
            qreal dieWidth = (ptRect.width() - (dieCols + 1) * dieMargin) / dieCols;
            qreal dieHeight = (ptRect.height() - (dieRows + 1) * dieMargin) / dieRows;

            int fontSize_2 = qMax(static_cast<int>(qMin(dieWidth, dieHeight) * 0.2), 1);
            QFont font_2;
            font_2.setPointSize(fontSize_2);

            foreach(const ns_mat::POINT_INFO_STRUCT & point, points) {
                // 计算固晶点位置
                QRectF dieRect(
                    ptRect.x() + point.stIndex.iPtCol * (dieWidth + dieMargin) + dieMargin,
                    ptRect.y() + point.stIndex.iPtRow * (dieHeight + dieMargin) + dieMargin,
                    dieWidth,
                    dieHeight
                );

                // 绘制固晶点
                BondItem* dieItem = new BondItem(point);
                dieItem->setRect(dieRect);
                m_pScene->addItem(dieItem);

                // 添加固晶点编号
                QGraphicsTextItem* dieText = new QGraphicsTextItem(dieItem);
                dieText->setPlainText("PT" + QString::number(point.stIndex.iIndex));
                dieText->setFont(font_2);
                dieText->setPos(dieRect.center() - QPointF(dieText->boundingRect().width() / 2,
                    dieText->boundingRect().height() / 2));
            }
        }
    }

    m_pView->setScene(m_pScene);
    m_pView->resize(width, height);
}
*/
void Bond::initFrom(QWidget* parent) {
    m_pScene = new QGraphicsScene(parent);
    m_pView = new BondGraphicsView(m_pScene);
    m_pView->setCViewInterface(m_pCViewInterface);

    int width = parent->width();
    int height = parent->height();
    double maxWidth = maxPoint.x() - minPoint.x();
    double maxHeight = maxPoint.y() - minPoint.y();
    double ratio;

    if (maxHeight > maxWidth) {
        ratio = maxHeight / (width - 100);
    }
    else {
        ratio = maxWidth / (width - 100);
    }
    //目前没提供pt固晶点大小，以下用测试大小，后续可替换(实际大小，接口替换处)
    double dieWidth = 20000;
    double dieHeight = 20000;

    QFont matrixFont;
    double matrixFontSize = qMin(dieWidth/ratio, dieHeight / ratio)*0.1;
    matrixFont.setPointSizeF(matrixFontSize);  // 使用浮点大小

    if (bondData.size() == 0) {
        return;
    }

    for (int i = 0; i < bondData.size(); ++i) {

        // 绘制固晶点

        //转换大小
        double dieWidthr = dieWidth / ratio;
        double dieHeightr = dieHeight / ratio;
        double diex, diey;
        diex =  (bondData[i].stBondStatus.stAlnBondPosition.x - minPoint.x() + dieWidth) / ratio;
        diey =  (bondData[i].stBondStatus.stAlnBondPosition.y - minPoint.y() + dieHeight) / ratio;


        // 计算固晶点位置
        QRectF dieRect(
            diex,
            diey,
            dieWidthr,
            dieHeightr
        );
        BondItem* dieItem = new BondItem(bondData[i]);
        dieItem->setRect(dieRect);
        dieItem->setZValue(1.0);
        m_pScene->addItem(dieItem);
        // 添加固晶点编号
        QGraphicsTextItem* dieText = new QGraphicsTextItem(dieItem);
        dieText->setPlainText("PT" + QString::number(bondData[i].stIndex.iIndex));
        double dieFontSize = qMin(dieWidthr, dieHeightr) * 0.2;
        QFont font;
        font.setPointSizeF(dieFontSize);  // 使用浮点大小
        dieText->setFont(font);
        dieText->setPos(dieRect.center() - QPointF(dieText->boundingRect().width() / 2,
            dieText->boundingRect().height() / 2));
    }

    QPen ptpen(Qt::blue, 0.5);
    QPen pcbpen(Qt::red, 0.5);
    QPen subpen(Qt::black, 0.5);
    //绘制pt矩阵和Pcb矩阵
    POINT_INFO_STRUCT maxPcbPoint = m_vptMaxPoints[0];
    POINT_INFO_STRUCT minPcbPoint = m_vptMaxPoints[0];
    int pcbmatx, pcbmaty, pcbmatWidth, pcbmatHeight;
    QVector<POINT_INFO_STRUCT> maxSubPoints;
    QVector<POINT_INFO_STRUCT> minSubPoints;

    for (int i = 0;i < m_vptMaxPoints.size();i++) {

        if (minPcbPoint.stIndex.iPcbRow != m_vptMinPoints[i].stIndex.iPcbRow || minPcbPoint.stIndex.iPcbCol != m_vptMinPoints[i].stIndex.iPcbCol) {
            //绘制pcb矩阵
            
            pcbmatx = (minPcbPoint.stBondStatus.stAlnBondPosition.x - minPoint.x() + 0.4 * dieWidth) / ratio;
            pcbmaty = (minPcbPoint.stBondStatus.stAlnBondPosition.y - minPoint.y() + 0.4 * dieHeight) / ratio;
            pcbmatWidth = (maxPcbPoint.stBondStatus.stAlnBondPosition.x - minPcbPoint.stBondStatus.stAlnBondPosition.x + dieWidth * 2.2) / ratio;
            pcbmatHeight = (maxPcbPoint.stBondStatus.stAlnBondPosition.y - minPcbPoint.stBondStatus.stAlnBondPosition.y + dieHeight * 2.2) / ratio;
            QRectF pcbRect(
                pcbmatx,
                pcbmaty,
                pcbmatWidth,
                pcbmatHeight
                
            );
            // 绘制PCB矩阵背景
            QGraphicsRectItem* pcbItem = new QGraphicsRectItem(pcbRect);
            pcbItem->setPen(pcbpen);
            //ptItem->setBrush(QColor("#d5e4f8"));
            m_pScene->addItem(pcbItem);
            // 添加PCB标签
            QRectF pcbTextRect(
                pcbmatx,
                pcbmaty,
                dieWidth / ratio * 0.6,
                dieHeight / ratio * 0.2
            );
            QGraphicsRectItem* pcbTextItem = new QGraphicsRectItem(pcbTextRect);
            pcbTextItem->setPen(Qt::NoPen);
            m_pScene->addItem(pcbTextItem);

            QGraphicsTextItem* pcbText = new QGraphicsTextItem(pcbTextItem);
            pcbText->setPlainText(QString(QString(tr("Pcb%1*%2")).arg(minPcbPoint.stIndex.iPcbRow).arg(minPcbPoint.stIndex.iPcbCol)));
            pcbText->setFont(matrixFont);
            // 将文本居中于 pcbTextRect
            pcbText->setPos(pcbTextRect.center() - QPointF(pcbText->boundingRect().width() / 2,
                pcbText->boundingRect().height() / 2));
            pcbText->setFont(matrixFont);

            maxSubPoints.append(maxPcbPoint);
            minSubPoints.append(minPcbPoint);
            maxPcbPoint = m_vptMaxPoints[i];
            minPcbPoint = m_vptMinPoints[i];
        }
        else {
            if (m_vptMaxPoints[i].stBondStatus.stAlnBondPosition.x > maxPcbPoint.stBondStatus.stAlnBondPosition.x)
                maxPcbPoint = m_vptMaxPoints[i];
            if (m_vptMinPoints[i].stBondStatus.stAlnBondPosition.x < minPcbPoint.stBondStatus.stAlnBondPosition.x)
                minPcbPoint = m_vptMinPoints[i];
            if (m_vptMaxPoints[i].stBondStatus.stAlnBondPosition.y > maxPcbPoint.stBondStatus.stAlnBondPosition.y)
                maxPcbPoint = m_vptMaxPoints[i];
            if (m_vptMinPoints[i].stBondStatus.stAlnBondPosition.y < minPcbPoint.stBondStatus.stAlnBondPosition.y)
                minPcbPoint = m_vptMinPoints[i];

        }


        int ptmatx, ptmaty, ptmatWidth, ptmatHeight;
        ptmatx = (m_vptMinPoints[i].stBondStatus.stAlnBondPosition.x - minPoint.x() + 0.7 * dieWidth) / ratio ;
        ptmaty = (m_vptMinPoints[i].stBondStatus.stAlnBondPosition.y - minPoint.y() + 0.7 * dieHeight) / ratio ;
        ptmatWidth = (m_vptMaxPoints[i].stBondStatus.stAlnBondPosition.x - m_vptMinPoints[i].stBondStatus.stAlnBondPosition.x +dieWidth*1.6)/ratio;
        ptmatHeight = (m_vptMaxPoints[i].stBondStatus.stAlnBondPosition.y - m_vptMinPoints[i].stBondStatus.stAlnBondPosition.y + dieHeight*1.6) / ratio;

        QRectF ptRect(
            ptmatx,
            ptmaty,
            ptmatWidth,
            ptmatHeight
        );
        //qDebug() << m_vptMinPoints[i].stBondStatus.stAlnBondPosition.x << "   " << m_vptMinPoints[i].stBondStatus.stAlnBondPosition.y;
        //qDebug() << m_vptMaxPoints[i].stBondStatus.stAlnBondPosition.x << "   " << m_vptMaxPoints[i].stBondStatus.stAlnBondPosition.y;
        // 绘制PT矩阵背景
        QGraphicsRectItem* ptItem = new QGraphicsRectItem(ptRect);
        ptItem->setPen(ptpen);
        //ptItem->setBrush(QColor("#d5e4f8"));
        m_pScene->addItem(ptItem);
        // 添加PT矩阵标签
        QRectF ptTextRect(
            ptmatx,
            ptmaty,
            dieWidth/ratio* 0.6,
            dieHeight / ratio * 0.2
        );
        QGraphicsRectItem* ptTextItem = new QGraphicsRectItem(ptTextRect);
        ptTextItem->setPen(Qt::NoPen);
        m_pScene->addItem(ptTextItem);

        QGraphicsTextItem* ptText = new QGraphicsTextItem(ptTextItem);
        ptText->setPlainText(QString(tr("PtMat%1")).arg(m_vptMinPoints[i].stIndex.iPtMatId));
        ptText->setFont(matrixFont);
        // 将文本居中于 ptTextRect
        ptText->setPos(ptTextRect.center()- QPointF(ptText->boundingRect().width() / 2,
            ptText->boundingRect().height() / 2));
        


    }
    pcbmatx = (minPcbPoint.stBondStatus.stAlnBondPosition.x - minPoint.x() + 0.4 * dieWidth) / ratio;
    pcbmaty = (minPcbPoint.stBondStatus.stAlnBondPosition.y - minPoint.y() + 0.4 * dieHeight) / ratio;
    pcbmatWidth = (maxPcbPoint.stBondStatus.stAlnBondPosition.x - minPcbPoint.stBondStatus.stAlnBondPosition.x + dieWidth * 2.2) / ratio;
    pcbmatHeight = (maxPcbPoint.stBondStatus.stAlnBondPosition.y - minPcbPoint.stBondStatus.stAlnBondPosition.y + dieHeight * 2.2) / ratio;
    QRectF pcbRect(
        pcbmatx,
        pcbmaty,
        pcbmatWidth,
        pcbmatHeight

    );
    // 绘制PCB矩阵背景
    QGraphicsRectItem* pcbItem = new QGraphicsRectItem(pcbRect);
    pcbItem->setPen(pcbpen);
    //ptItem->setBrush(QColor("#d5e4f8"));
    m_pScene->addItem(pcbItem);
    // 添加PCB标签
    QRectF pcbTextRect(
        pcbmatx,
        pcbmaty,
        dieWidth / ratio * 0.6,
        dieHeight / ratio * 0.2
    );
    QGraphicsRectItem* pcbTextItem = new QGraphicsRectItem(pcbTextRect);
    pcbTextItem->setPen(Qt::NoPen);
    m_pScene->addItem(pcbTextItem);

    QGraphicsTextItem* pcbText = new QGraphicsTextItem(pcbTextItem);
    pcbText->setPlainText(QString(QString(tr("Pcb%1*%2")).arg(minPcbPoint.stIndex.iPcbRow).arg(minPcbPoint.stIndex.iPcbCol)));
    pcbText->setFont(matrixFont);
    // 将文本居中于 pcbTextRect
    pcbText->setPos(pcbTextRect.center() - QPointF(pcbText->boundingRect().width() / 2,
        pcbText->boundingRect().height() / 2));
    pcbText->setFont(matrixFont);

    //绘制sub矩阵
    maxSubPoints.append(maxPcbPoint);
    minSubPoints.append(minPcbPoint);
    POINT_INFO_STRUCT maxSubPoint = maxSubPoints[0];
    POINT_INFO_STRUCT minSubPoint = minSubPoints[0];
    int submatx, submaty, submatWidth, submatHeight;
    for (int i = 0;i < maxSubPoints.size();i++) {
        if (maxSubPoint.stIndex.iPcbMatId != maxSubPoints[i].stIndex.iPcbMatId) {
            submatx = (minSubPoint.stBondStatus.stAlnBondPosition.x - minPoint.x() + 0.1 * dieWidth) / ratio;
            submaty = (minSubPoint.stBondStatus.stAlnBondPosition.y - minPoint.y() + 0.1 * dieHeight) / ratio;
            submatWidth = (maxSubPoint.stBondStatus.stAlnBondPosition.x - minSubPoint.stBondStatus.stAlnBondPosition.x + dieWidth * 2.8) / ratio;
            submatHeight = (maxSubPoint.stBondStatus.stAlnBondPosition.y - minSubPoint.stBondStatus.stAlnBondPosition.y + dieHeight * 2.8) / ratio;
            QRectF subRect(
                submatx,
                submaty,
                submatWidth,
                submatHeight

            );
            // 绘制SUB矩阵背景
            QGraphicsRectItem* subItem = new QGraphicsRectItem(subRect);
            subItem->setPen(subpen);
            //ptItem->setBrush(QColor("#d5e4f8"));
            m_pScene->addItem(subItem);

            // 添加PCB标签
            QRectF subTextRect(
                submatx,
                submaty,
                dieWidth / ratio * 0.6,
                dieHeight / ratio * 0.2
            );
            QGraphicsRectItem* subTextItem = new QGraphicsRectItem(subTextRect);
            subTextItem->setPen(Qt::NoPen);
            m_pScene->addItem(subTextItem);

            QGraphicsTextItem* subText = new QGraphicsTextItem(subTextItem);
            subText->setPlainText(QString(QString(tr("Sub%1")).arg(minSubPoint.stIndex.iPcbMatId)));
            subText->setFont(matrixFont);
            // 将文本居中于 pcbTextRect
            subText->setPos(subTextRect.center() - QPointF(subText->boundingRect().width() / 2,
                subText->boundingRect().height() / 2));
            subText->setFont(matrixFont);
        }
        else {
            if (maxSubPoints[i].stBondStatus.stAlnBondPosition.x > maxSubPoint.stBondStatus.stAlnBondPosition.x)
                maxSubPoint = maxSubPoints[i];
            if (minSubPoints[i].stBondStatus.stAlnBondPosition.x < minSubPoint.stBondStatus.stAlnBondPosition.x)
                minPcbPoint = minSubPoints[i];
            if (maxSubPoints[i].stBondStatus.stAlnBondPosition.y > maxSubPoint.stBondStatus.stAlnBondPosition.y)
                maxSubPoint = maxSubPoints[i];
            if (minSubPoints[i].stBondStatus.stAlnBondPosition.y < minSubPoint.stBondStatus.stAlnBondPosition.y)
                minSubPoint = minSubPoints[i];
        }
    }
    submatx = (minSubPoint.stBondStatus.stAlnBondPosition.x - minPoint.x() + 0.1 * dieWidth) / ratio;
    submaty = (minSubPoint.stBondStatus.stAlnBondPosition.y - minPoint.y() + 0.1 * dieHeight) / ratio;
    submatWidth = (maxSubPoint.stBondStatus.stAlnBondPosition.x - minSubPoint.stBondStatus.stAlnBondPosition.x + dieWidth * 2.8) / ratio;
    submatHeight = (maxSubPoint.stBondStatus.stAlnBondPosition.y - minSubPoint.stBondStatus.stAlnBondPosition.y + dieHeight * 2.8) / ratio;
    QRectF subRect(
        submatx,
        submaty,
        submatWidth,
        submatHeight

    );
    
    QGraphicsRectItem* subItem = new QGraphicsRectItem(subRect);
    // 设置边框颜色为红色，线宽为2
    subItem->setPen(subpen);
    // 绘制SUB矩阵背景
    //ptItem->setBrush(QColor("#d5e4f8"));
    m_pScene->addItem(subItem);
    // 添加PCB标签
    QRectF subTextRect(
        submatx,
        submaty,
        dieWidth / ratio * 0.6,
        dieHeight / ratio * 0.2
    );
    QGraphicsRectItem* subTextItem = new QGraphicsRectItem(subTextRect);
    subTextItem->setPen(Qt::NoPen);
    m_pScene->addItem(subTextItem);

    QGraphicsTextItem* subText = new QGraphicsTextItem(subTextItem);
    subText->setPlainText(QString(QString(tr("Sub%1")).arg(minSubPoint.stIndex.iPcbMatId)));
    subText->setFont(matrixFont);
    // 将文本居中于 pcbTextRect
    subText->setPos(subTextRect.center() - QPointF(subText->boundingRect().width() / 2,
        subText->boundingRect().height() / 2));
    subText->setFont(matrixFont);

    m_pView->setScene(m_pScene);
    m_pView->resize(width, height);

    // 创建一个 QPixmap 对象用于保存绘制的图像
    globalPixmap = QPixmap(width, height);
    globalPixmap.fill(Qt::white);  // 填充背景色为白色
    QPixmap originalPixmap = QPixmap::grabWidget(m_pView);
    // 设置目标尺寸（例如：宽度 200，高度 150）
    QSize targetSize(width, height);

    // 不保持比例，直接拉伸到指定尺寸
    QPixmap scaledPixmap = originalPixmap.scaled(
        targetSize,
        Qt::IgnoreAspectRatio,
        Qt::SmoothTransformation
    );
    globalPixmap = scaledPixmap;

    

}

void Bond::paintInitFrom(QWidget* parent) {
    /*
    int width = parent->width();
    int height = parent->height();

    globalPixmap = QPixmap(width, height);
    globalPixmap.fill(Qt::white);

    QPainter painter(&globalPixmap);
    painter.setRenderHint(QPainter::Antialiasing);
    QFont baseFont = painter.font();

    // Step 1: 收集PCB全局布局信息
    QMap<QPair<int, int>, int> pcbPosMap;
    QSet<int> uniquePcbIds;
    foreach(const ns_mat::POINT_INFO_STRUCT & point, bondData) {
        QPair<int, int> pos(point.stIndex.iPcbRow, point.stIndex.iPcbCol);
        if (!pcbPosMap.contains(pos)) {
            pcbPosMap[pos] = point.stIndex.iPcbMatId;
        }
        uniquePcbIds.insert(point.stIndex.iPcbMatId);
    }

    // 计算PCB全局行列数
    int maxPcbRow = 0, maxPcbCol = 0;
    for (const QPair<int, int>& pos : pcbPosMap.keys()) {
        maxPcbRow = qMax(maxPcbRow, pos.first);
        maxPcbCol = qMax(maxPcbCol, pos.second);
    }

    int pcbRows = maxPcbRow + 1;
    int pcbCols = maxPcbCol + 1;

    //TODO:yang
    maxPcbCol = 1;

    // Step 2: 计算PCB布局参数
    qreal margin = width / maxPcbCol * 0.05;
    qreal pcbSpacing = margin;
    qreal totalWidth = width - 2 * margin;
    qreal totalHeight = height - 2 * margin;
    qreal pcbWidth = (totalWidth - (pcbCols - 1) * pcbSpacing) / pcbCols;
    qreal pcbHeight = (totalHeight - (pcbRows - 1) * pcbSpacing) / pcbRows;

    // Step 3: 预处理数据分组
    QMap<int, QMap<int, QList<ns_mat::POINT_INFO_STRUCT>>> groupedData;
    foreach(const ns_mat::POINT_INFO_STRUCT & point, bondData) {
        groupedData[point.stIndex.iPcbMatId][point.stIndex.iPtMatId].append(point);
    }

    // 绘制PCB并记录位置
    QMap<int, QRectF> pcbRects;
    for (int row = 0; row < pcbRows; ++row) {
        for (int col = 0; col < pcbCols; ++col) {
            QPair<int, int> pos(row, col);
            if (pcbPosMap.contains(pos)) {
                int pcbId = pcbPosMap[pos];
                QRectF rect(
                    margin + col * (pcbWidth + pcbSpacing),
                    margin + row * (pcbHeight + pcbSpacing),
                    pcbWidth,
                    pcbHeight
                );
                pcbRects[pcbId] = rect;

                // 绘制PCB背景
                painter.setPen(Qt::NoPen);
                painter.setBrush(QColor("#e1d4e6"));
                painter.drawRect(rect);
            }
        }
    }

    // Step 4: 绘制PT矩阵和固晶点
    foreach(int pcbId, uniquePcbIds) {
        QRectF pcbRect = pcbRects.value(pcbId);
        if (!pcbRect.isValid()) continue;

        // 获取当前PCB的所有PT矩阵
        QList<int> ptMatIds = groupedData[pcbId].keys();
        int ptMatCount = ptMatIds.size();
        if (ptMatCount == 0) continue;

        // 计算PT矩阵布局行列数（方形布局）
        int ptRows = std::ceil(std::sqrt(ptMatCount));
        int ptCols = std::ceil(static_cast<qreal>(ptMatCount) / ptRows);
        while (ptRows * ptCols < ptMatCount) ptCols++;

        qreal ptMargin = qMin(pcbWidth / ptCols * 0.1, pcbHeight / ptRows * 0.1);

        // 计算PT矩阵尺寸
        qreal ptWidth = (pcbRect.width() - (ptCols + 1) * ptMargin) / ptCols;
        qreal ptHeight = (pcbRect.height() - (ptRows + 1) * ptMargin) / ptRows;

        // 绘制每个PT矩阵
        for (int i = 0; i < ptMatIds.size(); ++i) {
            int ptId = ptMatIds[i];
            int row = i / ptCols;
            int col = i % ptCols;

            QRectF ptRect(
                pcbRect.x() + col * (ptWidth + ptMargin) + ptMargin,
                pcbRect.y() + row * (ptHeight + ptMargin) + ptMargin,
                ptWidth,
                ptHeight
            );

            // 绘制PT矩阵背景
            painter.setPen(Qt::NoPen);
            painter.setBrush(QColor("#d5e4f8"));
            painter.drawRect(ptRect);

            // Step 5: 绘制固晶点
            QList<ns_mat::POINT_INFO_STRUCT> points = groupedData[pcbId][ptId];
            if (points.isEmpty()) continue;

            // 获取固晶点矩阵尺寸
            QPair<int, int> dieDims = ptDimensions[pcbId][ptId];
            int dieRows = dieDims.first;
            int dieCols = dieDims.second;

            qreal dieMargin = qMin(ptWidth / dieCols * 0.3, ptHeight / dieRows * 0.3);

            // 计算固晶点尺寸
            qreal dieWidth = (ptRect.width() - (dieCols + 1) * dieMargin) / dieCols;
            qreal dieHeight = (ptRect.height() - (dieRows + 1) * dieMargin) / dieRows;

            foreach(const ns_mat::POINT_INFO_STRUCT & point, points) {
                // 计算固晶点位置
                QRectF dieRect(
                    ptRect.x() + point.stIndex.iPtCol * (dieWidth + dieMargin) + dieMargin,
                    ptRect.y() + point.stIndex.iPtRow * (dieHeight + dieMargin) + dieMargin,
                    dieWidth,
                    dieHeight
                );

                // 绘制固晶点
                painter.setPen(Qt::NoPen);
                //painter.setBrush(getColorByStatus(point.stBondStatus.bDieStatus));
                painter.drawRect(dieRect);
            }
        }
    }
    painter.end();
    */
}

void Bond::UpdataVal(std::vector<ns_mat::POINT_INFO_STRUCT>& stPointInfo)
{
    maxPoint = QPointF(stPointInfo[0].stBondStatus.stAlnBondPosition.x, stPointInfo[0].stBondStatus.stAlnBondPosition.y);
    minPoint = QPointF(stPointInfo[0].stBondStatus.stAlnBondPosition.x, stPointInfo[0].stBondStatus.stAlnBondPosition.y);
    QVector<POINT_INFO_STRUCT> ptMatrix;
    QMap<int, QMap<int, QVector<POINT_INFO_STRUCT>>> pcbMatrix;
    UINT iPcbMatId = stPointInfo[0].stIndex.iPcbMatId;
    UINT iPtId = stPointInfo[0].stIndex.iPtMatId;

    POINT_INFO_STRUCT ptMinPoint = stPointInfo[0];
    POINT_INFO_STRUCT ptMaxPoint = stPointInfo[0];

    QMap<int, QPointF> ptMinPointmap;
    QMap<int, QPointF> ptMaxPointmap;
    QMap<int, QMap<int, QPointF>> pcbMinPointmap;
    QMap<int, QMap<int, QPointF>> pcbMaxPointmap;

    int pcbRow = stPointInfo[0].stIndex.iPcbRow;
    int pcbCol = stPointInfo[0].stIndex.iPcbCol;
    int pcbId = 1;
    for (auto&a: stPointInfo)
    {
        bondData.append(a);

        if (a.stIndex.iPtMatId == iPtId) {
            ptMatrix.append(a);
        }
        else {

            m_vptMaxPoints.append(ptMaxPoint);
            m_vptMinPoints.append(ptMinPoint);
            iPtId = a.stIndex.iPtMatId;
            ptMaxPoint = a;
            ptMinPoint = a;

        }
        //遍历找到最小和最大边界点
        if (a.stBondStatus.stAlnBondPosition.x > maxPoint.x())
            maxPoint.setX(a.stBondStatus.stAlnBondPosition.x);
        if(a.stBondStatus.stAlnBondPosition.x < minPoint.x())
            minPoint.setX(a.stBondStatus.stAlnBondPosition.x);
        if (a.stBondStatus.stAlnBondPosition.y > maxPoint.y())
            maxPoint.setY(a.stBondStatus.stAlnBondPosition.y);
        if (a.stBondStatus.stAlnBondPosition.y < minPoint.y())
            minPoint.setY(a.stBondStatus.stAlnBondPosition.y);
        
        //判断pt最小和最大对角点
        if (a.stBondStatus.stAlnBondPosition.x > ptMaxPoint.stBondStatus.stAlnBondPosition.x)
            ptMaxPoint = a;
        if (a.stBondStatus.stAlnBondPosition.x < ptMinPoint.stBondStatus.stAlnBondPosition.x)
            ptMinPoint = a;
        if (a.stBondStatus.stAlnBondPosition.y > ptMaxPoint.stBondStatus.stAlnBondPosition.y)
            ptMaxPoint = a;
        if (a.stBondStatus.stAlnBondPosition.y < ptMinPoint.stBondStatus.stAlnBondPosition.y)
            ptMinPoint = a;
        /*
        if (a.stIndex.iPcbMatId == iPcbMatId && a.stIndex.iPtMatId == iPtId && (pcbRow == a.stIndex.iPcbRow && pcbCol == a.stIndex.iPcbCol)) {
            ptMatrix.append(a);
        }
        else {
            if (a.stIndex.iPcbMatId == iPcbMatId && (pcbRow == a.stIndex.iPcbRow && pcbCol == a.stIndex.iPcbCol)) {
                m_pPtMatrixMap.insert(iPtId, ptMatrix);
                ptMatrix.clear();
                ptMinPointmap.insert(iPtId, ptMinPoint);
                ptMaxPointmap.insert(iPtId, ptMaxPoint);
                ptMinPointmap.clear();
                ptMaxPointmap.clear();
                iPtId = a.stIndex.iPtMatId;

            }
            else {
                m_pPcbMatrixMap.insert(iPcbMatId, m_pPtMatrixMap);
                m_pcbMinPointmap.insert(iPcbMatId, ptMinPointmap);
                m_pcbMaxPointmap.insert(iPcbMatId, ptMaxPointmap);
                pcbMatrix.clear();
                iPcbMatId = a.stIndex.iPcbMatId;
                m_pPtMatrixMap.clear();

            }
        }   
        */
 

        qDebug() << a.stBondStatus.stAlnBondPosition.x << "   " << a.stBondStatus.stAlnBondPosition.y;
        //qDebug() << a.stIndex.iPtMatId << "   " << a.stIndex.iPcbMatId;

    }
    m_vptMaxPoints.append(ptMaxPoint);
    m_vptMinPoints.append(ptMinPoint);
    //m_pPtMatrixMap.insert(iPtId, ptMatrix);
    //m_pPcbMatrixMap.insert(iPcbMatId, m_pPtMatrixMap);
    //ptMinPointmap.insert(iPtId, ptMinPoint);
    //ptMaxPointmap.insert(iPtId, ptMaxPoint);
    //m_pcbMinPointmap.insert(iPcbId, ptMinPointmap);
    //m_pcbMaxPointmap.insert(iPcbId, ptMaxPointmap);
    
}

QPixmap Bond::getGlobalPixmap() const {
    return globalPixmap;
}

void Bond::setBondInfo(ns_module::CViewInterface* CViewInterface) {
    m_pCViewInterface = CViewInterface;
}