JSBTDieBondH/Output/inc/Module/CBondMatrix.h

#pragma once
#include "CManageDB.h"
#include <map>
#include <mutex>

#ifdef BOND_MATRIX_EXPORTS
#define BOND_CMATRIX_DLL_API __declspec(dllexport)
#else
#define BOND_CMATRIX_DLL_API //__declspec(dllimport)
#endif

using namespace ns_db;

namespace ns_mat
{
	typedef struct
	{
		PICKBOND_PARAM_STRUCT stWaferParam;		//晶片台\华夫盒取晶参数
		PICKBOND_PARAM_STRUCT stCalibBondParam;	//校准台放晶参数
		UINT nTemplate_Pick;					//取晶模板号
		UINT nPickHeadIdByTable;				//取晶吸嘴在吸嘴架上的Id号
		UINT nMatrixId;						//使用的晶片台\华夫盒号（矩阵号）
	}PICK_PARAM;

	typedef struct
	{
		//固晶过程中用到得数据，且由用户设置，需保存到数据库的参数
		PICKBOND_PARAM_STRUCT stCalibPickParam;		//校准台取晶参数
		PICKBOND_PARAM_STRUCT stBondParam;			//固晶台固晶参数

		UINT nTemplate_BondFront;					//固前检测模板ID号 0为不检测
		UINT nTemplate_BondBack;					//固后检测模板ID号 0为不检测
		//UINT nTemplate_SearchModel;					//到模板位置后是否拍照 0为不拍照
		UINT nTemplate_Bond;						//固晶点对点模板ID号 
		UINT nTemplate_Calib;						//中转台校准模板号  0为不拍照
		UINT nTemplate_LookUp;						//上视对点模板号    0为不拍照

		UINT nBondHeadIdByTable;					//固晶吸嘴在吸嘴架上的Id号

		X_Y_ANGLE_STRUCT stOffset;					//固晶点补偿(从编程的固晶点位置偏移)
	}BOND_PARAM;

	//固晶参数，由用于设置得到
	typedef struct
	{
		//全局把握的参数
		UINT iPcbMatId;						//对应的pcb号
		CALIB_DIE_TYPE nCalibType;			//校准方式 0:不校准  1:下视校准  2:校准台校准
		DIE_SOURCE nWaffleOrWaffer;			//0：华夫盒，1：晶圆台
		PICK_PARAM nPickParam;
		BOND_PARAM nBondParam;
	}PROCESS_INFO_STRUCT;

	//固晶顺序
	enum BOND_DIR {
		NO_SET = 0,
		//order顺序，按照遍历大矩阵第一格所有小矩阵再遍历第二格
		//Alternate顺序，按照遍历完相同的小矩阵再遍历第二种小矩阵
		OrderAndS = 1,/*弓字型*/
		AlternateAndZ = 2,
		OrderAndZ = 3,/*之字型*/
		AlternateAndS = 4,
	};

	typedef struct _BOND_INDEX_STRUCT
	{
		//UINT iProductId = 1;			//固晶点所在产品Id
		UINT iPcbMatId = 1;				//固晶点所在PCB Id
		UINT iPcbRow = 1;				//固晶点在PCB中所在行
		UINT iPcbCol = 1;				//固晶点在PCB中所在列
		UINT iPtMatId = 1;				//固晶点所在Pt矩阵Id
		UINT iPtRow = 1;				//固晶点在矩阵中所在行
		UINT iPtCol = 1;				//固晶点在矩阵中所在列
		UINT iIndex = 1;				//当前Point在整个Bond矩阵中的序号
	} BOND_MATRIX_POINT_INFO_STRUCT; //固晶点

	enum DIE_STATUS {
		//NO_PICK = 0,			/*未取晶*/
		//WAF_PICK_DONE,				/*已从晶片台取晶*/
		//TRANSFER_BOND_DONE,			/*已将晶片放到中转台*/
		NO_BOND,					//未进入固晶状态
		TRANSFER_PICK_DONE,			/*已从中转台取晶*/
		LOOKUP_CALIB_DONE,			/*已上视校准*/
		BOND_DONE,				/*已固晶*/
		BOND_DEL				/*不固晶点*/
	};
	enum PICK_STATUS
	{
		NO_PICK = 0, /*未取晶*/
		WAF_PICK_DONE,	/*已从晶片台取晶*/
		TRANSFER_BOND_DONE,			/*已将晶片放到中转台*/
	};

	//过程产生的关联数据
	typedef struct _BONDED_STATUS_STRUCT
	{
		//流程过程中的状态数据，不保存到数据库中
		DIE_STATUS bDieStatus;				//固晶状态
		PICK_STATUS bPickStatus;			//取晶状态
		bool bAlnStatus;					//对点状态,是否已对点
		bool bIsCheck;						//是否固后检测完成

		X_Y_ANGLE_STRUCT stLookUpOffset;	//上视拍照偏差结果
		XY_DOUBLE_STRUCT stSetBondPosition;	//程序设置的固晶位置
		XY_DOUBLE_STRUCT stAlnBondPosition;	//对点后的固晶位置
		XY_DOUBLE_STRUCT stAlnOffset;		//固晶点对点偏移
		double dAlnAngle;					//对点角度
		XY_DOUBLE_STRUCT stCheckOffset;		//固后检测结果
		double dCheckAngle;					//固后检测角度 

		_BONDED_STATUS_STRUCT()
		{
			bDieStatus = NO_BOND;
			bPickStatus = NO_PICK;
			bAlnStatus = false;
			bIsCheck = false;
			stSetBondPosition = 0;
			stAlnBondPosition = 0;
			dAlnAngle = 0;
			dCheckAngle = 0;
			stCheckOffset = 0.0;
		}
	} BOND_STATUS_STRUCT;

	typedef struct _POINT_INFO_STRUCT
	{
		BOND_MATRIX_POINT_INFO_STRUCT stIndex;
		BOND_STATUS_STRUCT stBondStatus;
		PROCESS_INFO_STRUCT stBondInfo;
	} POINT_INFO_STRUCT;


	/// <summary>
	/// 固晶、取晶编程位置信息
	/// </summary>
	class BOND_CMATRIX_DLL_API  CBondMatrix
	{
		//enum type { pick, bond };
	private:
		static std::mutex m_MatrixMutex;
		bool bIsInitSuccess = false;

		//当前点
		//UINT m_iCurrentBondIndex = 0;
		//矩阵总数
		UINT m_iBondAmount = 0;
		int m_iWaferDieNum = 0;
		int m_iWaffleDieNum = 0;

		BOND_DIR m_eBondDir = BOND_DIR::NO_SET;

		CProduct* m_pCProduct = nullptr;

		vector<PROGRAM_BOND_MATRIX_STRUCT> m_vetBondMatrix;				//Pcb矩阵,从数据库读出来未经处理的数据
		map<int, POINT_INFO_STRUCT> m_mapBondMatrixInfo;

		void Sort_OrderAndZ();
		void Sort_AlternateAndZ();
		void Sort_OrderAndS();
		void Sort_AlternateAndS();

		POINT_INFO_STRUCT CalPointInfo(UINT iPtId, PROGRAM_BOND_MATRIX_STRUCT pcbMatrix, PROGRAM_POINT_MATRIX_STRUCT ptMatrix, 
			int pcbRow, int pcbCol, int pointRow, int pointCol);
		LONG BondInfoConvertPorcessInfo(UINT iPcbId, BOND_INFO_STRUCT stBondInfo, PROCESS_INFO_STRUCT& stProcessInfo);

		void ProcessPointMatrix(const PROGRAM_BOND_MATRIX_STRUCT& pcbMatrix, const PROGRAM_POINT_MATRIX_STRUCT& pointMatrix, int i, int j);
		//void RecvTableChangNoticeFunction(string dbname, string tabname);

		void DataChangNotice(string strDbName, string strTableName);

	public:
		CBondMatrix();
		LONG LoadMatrix(BOND_DIR dir);

	public:
		//返回0表示没找到
		//UINT GetCurrentIndex();							//获取当前固晶点
		//LONG SetCurrentIndex(UINT nIndex);				//设置当前固晶点

		//获取包括当前固晶点开始的下个固晶点
		UINT GetNextBondIndex(UINT nIndex);							//获取从当前固晶点开始的下个固晶点
		UINT GetPrevBondIndex(UINT nIndex);

		UINT GetNextPickIndex(UINT nIndex,DIE_SOURCE eSource = DIE_SOURCE::BY_NUL);							//获取从当前固晶点开始的下个固晶点
		UINT GetPrevPickIndex(UINT nIndex, DIE_SOURCE eSource = DIE_SOURCE::BY_NUL);							//获取从当前固晶点开始的上个固晶点

		UINT GetAmount();									//获取总数
		int GetWaferPickAmount();
		int GetWafflePickAmount();

		//获取指定晶圆的位置信息
		LONG GetPintInfoByIndex(UINT nPtIndex, POINT_INFO_STRUCT& stPointInfo);
		LONG SetPintInfoByIndex(UINT nPtIndex, POINT_INFO_STRUCT stPointInfo);

		LONG GetAllBondParam(UINT nPtIndex,BOND_PARAM& bondParam);
		LONG GetAllPickParam(UINT nPtIndex, PICK_PARAM& pickParam);

		LONG SetBondParam(int nPtIndex, BOND_PARAM bondParam);
		LONG SetPickParam(int nPtIndex, PICK_PARAM pickParam);

		/// <summary>
		/// 设置固晶点对点信息，设置时，固晶点编号所应就的PCB一起设置并计算对点的位置
		/// </summary>
		/// <param name="nPtIndex">固晶点编号</param>
		/// <param name="stBasePosn">基准位置</param>
		/// <param name="dBaseAngle">基准角度</param>
		/// <param name="stAlnPosn">对点位置</param>
		/// <param name="dAlnAngle">对点角度</param>
		/// <returns></returns>
		LONG SetBondAlnInfo(UINT nPtIndex, XY_DOUBLE_STRUCT stBasePosn, DOUBLE dBaseAngle, XY_DOUBLE_STRUCT stAlnPosn, DOUBLE dAlnAngle);
		
		LONG SetBondAlnOffset(int index, X_Y_ANGLE_STRUCT offset);
		LONG SetLookupOffset(int index, X_Y_ANGLE_STRUCT offset);
		LONG ResetAlnStatus(UINT nPtIndex);										//清除对点状态，固晶点编号所对应的PCB一起清除

		LONG SetDieStatus(UINT nPtIndex, DIE_STATUS eStatus);					//设置固晶状态
		LONG SetPickStatus(UINT nPtIndex, PICK_STATUS eStatus);					//设置取晶状态

		LONG ClearWaferPickStatus();

		LONG ClearWafflePickStatus();

		LONG ClearAllBondInfo();												//清除所有固晶点的状态及信息

	};

}